Chemisches Zinn

Die 500 ml Lösung ist ausreichend für ca.0,5m² Platinenmaterial, das entspricht ca. 30 Euro-Karten.

Die Verarbeitung gestaltet sich einfach und unkompliziert. Nach 2-3 Minuten ist die Zinnschicht ca. 5µm dick.

Vorteile:

sehr guter Korrosionsschutz

gute Lötbarkeit

für SMD, durch gleichmäßige Oberfläche geeignet

Leiterplatten werden optisch ansprechender

Leiterplatten müssen keinen hohen Temperaturen ausgesetzt werden
Maße der Arbeitsschale: 200x125x35 mm

The 500 ml solution is sufficient for approx. 0.5 m² of circuit board material, which corresponds to approx. 30 Euro cards.

Processing is simple and straightforward. After 2-3 minutes, the tin layer is approx. 5 µm thick.

Advantages:

Very good corrosion protection

Good solderability

Suitable for SMD due to its uniform surface

Printed circuit boards become more visually appealing

Printed circuit boards do not need to be exposed to high temperatures

Dimensions of the working bowl: 200x125x35 mm

Translated with DeepL.com (free version)

The 500 ml solution is sufficient for approx. 0.5 m² of circuit board material, which corresponds to approx. 30 Euro cards.

Processing is simple and straightforward. After 2-3 minutes, the tin layer is approx. 5 µm thick.

Advantages:

Very good corrosion protection

Good solderability

Suitable for SMD due to its uniform surface

Printed circuit boards become more visually appealing

Printed circuit boards do not need to be exposed to high temperatures

Dimensions of the working bowl: 200x125x35 mm